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Architecting High-Performance Embedded Systems

You're reading from Architecting High-Performance Embedded Systems

Product type Book

Published in Feb 2021

Publisher Packt

ISBN-13 9781789955965

Pages 376 pages

Edition 1st Edition

Languages

Concepts

Embedded Systems

Author (1):

Jim Ledin

Table of Contents (15) Chapters

Preface

1. Section 1: Fundamentals of High-Performance Embedded Systems

2. Chapter 1: Architecting High-Performance Embedded Systems

3. Chapter 2: Sensing the World

4. Chapter 3: Operating in Real Time

5. Section 2: Designing and Constructing High-Performance Embedded Systems

6. Chapter 4: Developing Your First FPGA Program

7. Chapter 5: Implementing systems with FPGAs

8. Chapter 6: Designing Circuits with KiCad

9. Chapter 7: Building High-Performance Digital Circuits

10. Section 3: Implementing and Testing Real-Time Firmware

11. Chapter 8: Bringing Up the Board for the First Time

12. Chapter 9: The Firmware Development Process

13. Chapter 10: Testing and Debugging the Embedded System

14. Other Books You May Enjoy

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Reflow soldering and hand soldering

At this point, the PCB sits on your assembly workspace, fully populated with SMT components. Now, it is time to turn on your reflow oven or hot plate.

Reflow soldering

Regardless of what type of reflow system you use, exercise extreme care when moving the PCB from your workspace to the oven or hot plate. If you strike the board against an object or, worse, drop it, you are likely to find that all your hard work placing the components was done for naught.

Your level of involvement during reflow soldering depends greatly on the technical capabilities of your reflow system. If you are using a stock hot plate or toaster oven, it is entirely up to you to monitor the state of the PCB as the solder heats and melts. If you remove the board from the heat too soon, you will have areas of unmelted solder, which means electrical contact will be poor to nonexistent, and parts may fall off the board. If you wait too long to remove the board from the heat...

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Authors (1)

Jim Ledin

Jim Ledin is the CEO of Ledin Engineering, Inc. Jim is an expert in embedded software and hardware design and testing. He is also an expert in system cybersecurity assessment and penetration testing. He has a B.S. degree in aerospace engineering from Iowa State University and an M.S. degree in electrical and computer engineering from the Georgia Institute of Technology. Jim is a registered professional electrical engineer in California, a Certified Information System Security Professional (CISSP), a Certified Ethical Hacker (CEH), and a Certified Penetration Tester (CPT).

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