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Architecting High-Performance Embedded Systems

You're reading from   Architecting High-Performance Embedded Systems Design and build high-performance real-time digital systems based on FPGAs and custom circuits

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Product type Paperback
Published in Feb 2021
Publisher Packt
ISBN-13 9781789955965
Length 376 pages
Edition 1st Edition
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Author (1):
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Jim Ledin Jim Ledin
Author Profile Icon Jim Ledin
Jim Ledin
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Table of Contents (15) Chapters Close

Preface 1. Section 1: Fundamentals of High-Performance Embedded Systems
2. Chapter 1: Architecting High-Performance Embedded Systems FREE CHAPTER 3. Chapter 2: Sensing the World 4. Chapter 3: Operating in Real Time 5. Section 2: Designing and Constructing High-Performance Embedded Systems
6. Chapter 4: Developing Your First FPGA Program 7. Chapter 5: Implementing systems with FPGAs 8. Chapter 6: Designing Circuits with KiCad 9. Chapter 7: Building High-Performance Digital Circuits 10. Section 3: Implementing and Testing Real-Time Firmware
11. Chapter 8: Bringing Up the Board for the First Time 12. Chapter 9: The Firmware Development Process 13. Chapter 10: Testing and Debugging the Embedded System 14. Other Books You May Enjoy

Reflow soldering and hand soldering

At this point, the PCB sits on your assembly workspace, fully populated with SMT components. Now, it is time to turn on your reflow oven or hot plate.

Reflow soldering

Regardless of what type of reflow system you use, exercise extreme care when moving the PCB from your workspace to the oven or hot plate. If you strike the board against an object or, worse, drop it, you are likely to find that all your hard work placing the components was done for naught.

Your level of involvement during reflow soldering depends greatly on the technical capabilities of your reflow system. If you are using a stock hot plate or toaster oven, it is entirely up to you to monitor the state of the PCB as the solder heats and melts. If you remove the board from the heat too soon, you will have areas of unmelted solder, which means electrical contact will be poor to nonexistent, and parts may fall off the board. If you wait too long to remove the board from the heat...

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