Chapter 7: Building High-Performance Digital Circuits

This chapter presents the processes and techniques involved in assembling prototype high-performance digital circuits using surface-mount and through-hole electronic components. A recommended set of tools will be identified, including a soldering station, a magnifier or microscope, and tweezers for handling tiny parts. The reflow soldering process will also be introduced, along with descriptions of some low-cost options for implementing a small-scale reflow capability.

Preparations for circuit assembly and the techniques of soldering by hand and with the reflow process will be presented in a manner that allows them to be applied to a wide variety of projects. Once soldering is complete, the board must be cleaned and thoroughly inspected to ensure all intended connections are intact and that no unintended solder connections exist before applying power.

After completing this chapter, you will have learned how to assemble digital...