Summary

This chapter introduced the processes and techniques involved in assembling high-performance digital circuits using surface-mount and through-hole electronic components. A recommended set of tools was identified, including a soldering station, a magnifier or microscope, and tweezers for handling tiny parts. Procedures for solder stenciling and preparing parts for assembly were presented in a step-by-step manner applicable to a wide variety of projects. After soldering, the steps involved in cleaning the board, performing a thorough inspection, and implementing any needed repairs were introduced.

Having completed this chapter, you should understand the tools and procedures required for solder stenciling and the steps involved in preparation for circuit board assembly. You learned how to solder surface-mount and through-hole components to the circuit board by hand and by using a reflow system, as well as how to clean the assembled board and thoroughly inspect it, including...